Re: [PATCH 5/8] thermal/drivers/int3400: Use thermal zone device wrappers

[srinivas pandruvada]

Hi Daniel,

On Wed, 2023-07-05 at 12:41 +0200, Daniel Lezcano wrote:
> 
> Hi Srinivas,
> 
> thanks for your answer. What about the patch 6?
I was not CCed. But checked from LKML, 
The change looks good.

Thanks,
Srinivas

> 
> 
> On 03/07/2023 18:15, srinivas pandruvada wrote:
> > Hi Daniel,
> > 
> > On Mon, 2023-07-03 at 12:49 +0200, Daniel Lezcano wrote:
> > > 
> > > Hi Srinivas,
> > > 
> > > do you agree with the changes in patches 5 and 6 ?
> > > 
> > > Thanks
> > > 
> > >     -- Daniel
> > > 
> > > 
> > > On 25/05/2023 16:01, Daniel Lezcano wrote:
> > > > The driver is accessing the thermal zone device structure but
> > > > the
> > > > accessors are already existing and we want to consolidate the
> > > > thermal
> > > > core code by preventing accesses to the internals from the
> > > > drivers.
> > > > 
> > > > Let's use these accessors.
> > > > 
> > > > On the other side, the code is getting directly the temperature
> > > > from
> > > > tz->temperature, but the temperature is a faked on, so we can
> > > > replace
> > > > this access by the fake temp and remove the thermal zone device
> > > > structure access.
> > > > 
> > May be something simple description like this will be enough.
> > 
> > "
> > Use thermal core API to access thermal zone "type" field instead of
> > directly using the structure field.
> > While here, remove access to temperature field, as this driver is
> > reporting fake temperature, which can be replaced with
> > INT3400_FAKE_TEMP. Also replace hardcoded 20C with
> > INT3400_FAKE_TEMP.
> > "
> > 
> > The change itself looks fine.
> 
>