Re: [PATCH 5/8] thermal/drivers/int3400: Use thermal zone device wrappers

[Daniel Lezcano]

Hi Srinivas,

thanks for your answer. What about the patch 6?


On 03/07/2023 18:15, srinivas pandruvada wrote:
> Hi Daniel,
>
> On Mon, 2023-07-03 at 12:49 +0200, Daniel Lezcano wrote:
> > Hi Srinivas,
> >
> > do you agree with the changes in patches 5 and 6 ?
> >
> > Thanks
> >
> >     -- Daniel
> >
> >
> > On 25/05/2023 16:01, Daniel Lezcano wrote:
> > > The driver is accessing the thermal zone device structure but the
> > > accessors are already existing and we want to consolidate the
> > > thermal
> > > core code by preventing accesses to the internals from the drivers.
> > >
> > > Let's use these accessors.
> > >
> > > On the other side, the code is getting directly the temperature
> > > from
> > > tz->temperature, but the temperature is a faked on, so we can
> > > replace
> > > this access by the fake temp and remove the thermal zone device
> > > structure access.
> May be something simple description like this will be enough.
>
> "
> Use thermal core API to access thermal zone "type" field instead of
> directly using the structure field.
> While here, remove access to temperature field, as this driver is
> reporting fake temperature, which can be replaced with
> INT3400_FAKE_TEMP. Also replace hardcoded 20C with INT3400_FAKE_TEMP.
> "
>
> The change itself looks fine.


--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog