Re: [PATCH v2] usb: dwc3: qcom: Remove ACPI support from glue driver

[Johan Hovold]

On Tue, Mar 05, 2024 at 03:02:16PM +0530, Krishna Kurapati wrote:
> Minimal ACPI support was added to the Qualcomm DWC3 glue driver in order to
> enable USB on SDM850 and SC8180X compute platforms. The support is still
> functional, but unnoticed regressions in other drivers indicates that no
> one actually booting any of platforms dependent on this implementation.
> 
> The functionality provides is the bare minimum and is not expected to aid
> in the effort of bringing full ACPI support to the driver in the future.
> 
> Remove the ACPI code from the Qualcomm DWC3 glue driver to aid in the
> implementation of improvements that are actually used like multiport and
> flattening device tree.
> 
> Commit message by Bjorn Andersson.
> 
> Signed-off-by: Krishna Kurapati <quic_kriskura@xxxxxxxxxxx>
> ---
> Changes in v2:
> Removed ACPI dependency in Kconfig.

Reviewed-by: Johan Hovold <johan+linaro@xxxxxxxxxx>