Re: [PATCH v13 05/10] usb: dwc3: qcom: Refactor IRQ handling in QCOM Glue driver

[Johan Hovold]

On Fri, Nov 24, 2023 at 04:08:42PM +0530, Krishna Kurapati PSSNV wrote:
> On 11/24/2023 3:43 PM, Johan Hovold wrote:

> > I'd suggest that you just send two separate series, one with binding and
> > driver updates, which will eventually be merged by Greg, and one with
> > the devicetree changes, which goes through Bjorn's tree.
> > 
> > It's good if you could add a link to the binding series in the cover
> > letter of the devicetree changes as they are of course going to be quite
> > closely related and need to be reviewed in parallel.
> 
> Thanks for this pointer. So for Multiport, can I do it this way:
> 
> 1. Core bindings and Core driver changes in one series. Now that we 
> finalized we don't be adding the ctrl_irq[1] as discussed on:
> https://lore.kernel.org/all/ZU33uWpStIobzyd6@xxxxxxxxxxxxxxxxxxxx/.
> 
> 2. QC bindings and QC driver changes for Multiport to be pushed after we 
> clean up the current driver and DT's (an effort which is going on 
> currently).

No, I was just referring to how to handle binding/driver vs devicetree
patches for USB where we send them separately (unlike for most other
subsystems).

The dwc3 core and Qualcomm glue parts should still go in the same series
for multiport support.

Whether to do the irq cleanup before or after adding multiport support
is a different question, but, yeah, it is probably best to do it before.

The question of whether we can drop ACPI support should also be
considered as that should also simplify your multiport series.

Johan