Re: [PATCH 09/12] dt-bindings: usb: qcom,dwc3: Rename to "glue"

[Johan Hovold]

On Mon, Oct 16, 2023 at 08:11:17PM -0700, Bjorn Andersson wrote:
> The Qualcomm USB block consists of three intertwined parts, the XHCI,
> the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents
> the Qualcomm glue part, with the other two represented as in a child
> node.
> 
> Rename the qcom,dwc3 binding, to represent that this is indeed only the
> glue part, to make room for a combined binding.
> 
> The large "select" is included to avoid the schema to be selected for
> validation with the upcoming flattened binding - which includes
> snps,dwc3 in the compatible.
> 
> Signed-off-by: Bjorn Andersson <quic_bjorande@xxxxxxxxxxx>
> ---
 
> -title: Qualcomm SuperSpeed DWC3 USB SoC controller
> +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue
> +
> +description:
> +  This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB
> +  controller found in many Qualcomm platforms, with the XHCI and DWC3 core

This should be "xHCI" throughout the series.

> +  portions described as a separate child device.
> +  The combined representation, defined by qcom,dwc3.yaml is preferred.

Johan