Re: [PATCH v1 10/13] thermal: core: Allow trip pointers to be used for cooling device binding

[Daniel Lezcano]

On 28/09/2023 12:38, Rafael J. Wysocki wrote:
> On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano
> <daniel.lezcano@xxxxxxxxxx> wrote:
> > On 21/09/2023 20:01, Rafael J. Wysocki wrote:
> > > From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
> > >
> > > Add new helper functions, thermal_bind_cdev_to_trip() and
> > > thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
> > > binding a cooling device to a trip point and unbinding it, respectively,
> > > and redefine the existing helpers, thermal_zone_bind_cooling_device()
> > > and thermal_zone_unbind_cooling_device(), as wrappers around the new
> > > ones, respectively.
> > >
> > > No intentional functional impact.
> > >
> > > Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
> > > ---
> >
> > Reviewed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx>
>
> Thanks so much for all of the reviews!

You are welcome. Thanks for cleaning up the ACPI code

> I'll now apply the patches for which you have given tags and respin
> the rest (governor changes) as a separate series on top of them.

Sounds good, thanks

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