Re: [PATCH v2 01/14] dt-bindings: thermal: qcom-tsens: Add compatible for SM6375

From: Konrad Dybcio
Date: Mon May 15 2023 - 21:08:06 EST




On 16.03.2023 15:12, Konrad Dybcio wrote:
> The Qualcomm SM6375 platform has two instances of the tsens v2.8.0 block,
> add a compatible for these instances.
>
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>
> Signed-off-by: Konrad Dybcio <konrad.dybcio@xxxxxxxxxx>
> ---
<bump>
This one got lost!

Konrad
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> 1 file changed, 1 insertion(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index 926e9c51c93c..d73b72dafcbc 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -56,6 +56,7 @@ properties:
> - qcom,sdm845-tsens
> - qcom,sm6115-tsens
> - qcom,sm6350-tsens
> + - qcom,sm6375-tsens
> - qcom,sm8150-tsens
> - qcom,sm8250-tsens
> - qcom,sm8350-tsens
>