Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226

From: Luca Weiss
Date: Sun May 07 2023 - 16:23:19 EST


On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
>
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@xxxxxxxxx>

Reviewed-by: Luca Weiss <luca@xxxxxxxxx>

> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
> 1 file changed, 1 insertion(+)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index
> 926e9c51c93c..d6b2957d5137 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -29,6 +29,7 @@ properties:
> items:
> - enum:
> - qcom,mdm9607-tsens
> + - qcom,msm8226-tsens
> - qcom,msm8916-tsens
> - qcom,msm8939-tsens
> - qcom,msm8974-tsens