Re: [PATCH v1 1/4] dt-bindings: thermal: tsens: Add ipq9574 compatible

[Varadarajan Narayanan]

On Wed, May 03, 2023 at 08:34:45AM +0200, Krzysztof Kozlowski wrote:
> On 03/05/2023 06:45, Varadarajan Narayanan wrote:
> > From: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx>
> >
> > Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
> >
> > Signed-off-by: Praveenkumar I <quic_ipkumar@xxxxxxxxxxx>
> > Signed-off-by: Varadarajan Narayanan <quic_varada@xxxxxxxxxxx>
> > ---
> >  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 3 +++
> >  1 file changed, 3 insertions(+)
> >
>
> I saw already v1, so this looks like v2, not v1. Please add changelog
> describing what you changed here.

No code change between v1 and v2 w.r.t this patch. The 4th patch
alone in this series has code changes between v1 and v2.

> > diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> > index d1ec963..8e2208c 100644
> > --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> > +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> > @@ -66,6 +66,7 @@ properties:
> >        - description: v2 of TSENS with combined interrupt
> >          enum:
> >            - qcom,ipq8074-tsens
> > +          - qcom,ipq9574-tsens
>
> This is a friendly reminder during the review process.
>
> It seems my previous comments were not fully addressed. Maybe my
> feedback got lost between the quotes, maybe you just forgot to apply it.
> Please go back to the previous discussion and either implement all
> requested changes or keep discussing them.
>
> Thank you.

Sorry. Looks like I missed https://lore.kernel.org/lkml/20230502080611.GB26126@xxxxxxxxxxxxxxxxxxxxxxxx/T/#m42a9b77be2ceddf1adc90c07f487929fcf2dbc0f
Will take that input and post a new version.

Thanks
Varada

> Best regards,
> Krzysztof
>