Re: [PATCH v4 0/6] Thermal zone device structure encapsulation

[Daniel Lezcano]

On 27/04/2023 19:23, Rafael J. Wysocki wrote:
> On Wed, Apr 19, 2023 at 10:33 AM Daniel Lezcano
> <daniel.lezcano@xxxxxxxxxx> wrote:
> > The thermal zone device structure is defined in the exported thermal
> > header include/linux/thermal.h
> >
> > Given the definition being public, the structure is exposed to the
> > external components other than the thermal framework core code. It
> > results the drivers are tampering the structure internals like taking
> > the lock or changing the field values.
> >
> > Obviously that is bad for several reasons as the drivers can hook the
> > thermal framework behavior and makes very difficult the changes in the
> > core code as external components depend on it directly.
> >
> > Moreover, the thermal trip points being reworked, we don't want the
> > drivers to access the trips array directly in the thermal zone
> > structure and doing assumptions on how they are organized.
> >
> > This series provides a second set of changes moving to the thermal
> > zone device structure self-encapsulation.
> >
> > The ACPI and the Menlon drivers are using the thermal zone's device
> > fields to create symlinks and new attributes in the sysfs thermal zone
> > directory. These changes provide a hopefully temporary wrapper to
> > access it in order to allow moving forward in the thermal zone device
> > self-encapsulation and a Kconfig option to disable by default such a
> > extra sysfs information.

[ ... ]

> Patches [4/6] and [6/6] were superseded by the Menlow driver removal.
>
> I've applied the rest as 6.4-rc material, with some subject
> adjustments and after removing some trailing white space in a few
> places.


Thanks!

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