Re: [PATCH v5 00/33] New thermal OF code

[Daniel Lezcano]

On 08/08/2022 12:55, Michael Walle wrote:
> Hi Daniel,

[ ... ]

> > > There seems to be one mistake within the new thermal code:

[ ... ]

> > > This was seen a sl28 board
> > > (arch/arm64/boot/dts/freescale/fsl-ls1028a-kontron-kbox-a-230-ls.dts).
> > > The same board in the KernelCI also have some more information:
> > > https://lavalab.kontron.com/scheduler/job/151900#L1162
> > >
> > > But I guess even if that is fixed, the driver will not probe due to the
> > > missing trip points? Are they now mandatory? Does it mean we'd need to
> > > update our device trees? But that will then mean older devices trees
> > > don't work anymore.
> >
> > Thanks for reporting, I'll investigate the issues you are reporting.
> >
> > There is no need to update any device tree file. The code does not
> > change the bindings, it is a rewrite of the implementation supposed to
> > be without impact on the existing bindings, thus the existing device
> > tree descriptions.
> >
> > Why are you saying there are missing trip points ? The dts shows trip
> > points for 'core-cluster' and 'ddr-controller' ?
>
> You are right. I've just looked at the error message:
>
> [    2.030452] thermal_sys: Failed to find 'trips' node
> [    2.033664] usb 1-1: new high-speed USB device number 2 using xhci-hcd
> [    2.035434] thermal_sys: Failed to find trip points for tmu id=2
>
> So maybe the code just don't find em.

For the board it seems there is no definition for tmu with id 2


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