Re: [PATCH v3 00/32] New thermal OF code

From: Daniel Lezcano
Date: Thu Jul 28 2022 - 11:12:26 EST



Hi Rafael,

On 28/07/2022 16:37, Rafael J. Wysocki wrote:
Hi Daniel,

On Wed, Jul 27, 2022 at 11:46 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxx> wrote:


Hi Rafael,

we are close to release v5.19.

I want to send a PR this week but it would be nice if this series could
be part of it, so the trip point rework we discussed earlier (it is a
long series) could be merged more easily for v5.21-rc1 as it will depend
on these changes.

This series was tested on different platforms, rk3399, broadcom and
rcar. The external drivers as ata, touchscreen, regulator, hwmon were
acked/reviewed and some other thermal drivers reviewed also. Some others
remain without feedback because the maintainer is unresponsive or the
driver is orphaned, falling under the thermal framework maintenance
umbrella. All the drivers changes are the same.

I do believe it does a nice cleanup and consolidation of the OF thermal
code and realign it with the core thermal framework.

Is it ok to merge the series?

I would prefer to put it into linux-next for a few days.

Why don't you send 2 pull requests, one with all of the other material
you have for 5.20 and another one with this series (it may be on top
of the first one)?

I will be able to defer pushing the second one till the second half of
the merge window.

Yes, I agree, if it is fine to do two pull requests, it seems very reasonable to let this series to mature in linux-next.

I will setup the 'next' branch with the first pull request material.

Thanks

-- Daniel


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