Re: [PATCH v6 00/12] thermal OF rework

From: Daniel Lezcano
Date: Mon Jul 25 2022 - 12:34:10 EST



Hi Rafael,

On 22/07/2022 21:59, Daniel Lezcano wrote:
The thermal framework initialization with the device tree appears to
be complicated and hard to make it to evolve.

It contains duplication of almost the same thermal generic structures
and has an assymetric initialization making hard any kind of serious
changes for more complex features. One of them is the multiple sensors
support per thermal zone.

In order to set the scene for the aforementioned feature with generic
code, we need to cleanup and rework the device tree initialization.

However this rework is not obvious because of the multiple components
entering in the composition of a thermal zone and being initialized at
different moments. For instance, a cooling device can be initialized
before a sensor, so the thermal zones must exist before the cooling
device as well as the sensor. This asynchronous initialization forces
the thermal zone to be created with fake ops because they are
mandotory and build a list of cooling devices which is used to lookup
afterwards when the cooling device driver is registering itself.

As there could be a large number of changes, this first series provide
some steps forward for a simpler device tree initialization.

More series for cleanup and code duplication removal will follow.

Changelog:

- v6:
- Folded patches 8, 9, 10
- Removed thermal_zone_get_trips() and thermal_zone_get_num_trips()
- Moved tz->ntrips => tz->num_trips changes into patch 11 to fix the
git bisecting


I believe all the comments were addressed, is it fine if I merge this series ?


--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog