[PATCH V5 0/3] Add thead,c900-plic support

From: guoren
Date: Sat Oct 23 2021 - 21:33:24 EST


From: Guo Ren <guoren@xxxxxxxxxxxxxxxxx>

Add the compatible string "thead,c900-plic" to the riscv plic
bindings to support allwinner d1 SOC which contains c906 core.

Changes since V5:
- Move back to mask/unmask
- Fixup the problem in eoi callback
- Remove allwinner,sun20i-d1 IRQCHIP_DECLARE
- Rewrite comment log
- Add DT list
- Fixup compatible string
- Remove allwinner-d1 compatible
- make dt_binding_check
- Add T-head vendor-prefixes

Changes since V4:
- Update description in errata style
- Update enum suggested by Anup, Heiko, Samuel
- Update comment by Anup
- Add cover-letter

Changes since V3:
- Rename "c9xx" to "c900"
- Add thead,c900-plic in the description section
- Add sifive_plic_chip and thead_plic_chip for difference

Changes since V2:
- Add a separate compatible string "thead,c9xx-plic"
- set irq_mask/unmask of "plic_chip" to NULL and point
irq_enable/disable of "plic_chip" to plic_irq_mask/unmask
- Add a detailed comment block in plic_init() about the
differences in Claim/Completion process of RISC-V PLIC and C9xx
PLIC.

Guo Ren (3):
dt-bindings: vendor-prefixes: add T-Head Semiconductor
dt-bindings: update riscv plic compatible string
irqchip/sifive-plic: Fixup thead,c900-plic request_threaded_irq with
ONESHOT

.../sifive,plic-1.0.0.yaml | 15 +++++--
.../devicetree/bindings/vendor-prefixes.yaml | 2 +
drivers/irqchip/irq-sifive-plic.c | 44 ++++++++++++++++++-
3 files changed, 56 insertions(+), 5 deletions(-)

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2.25.1