Re: [PATCH 0/14] v2 multi-die/package topology support

[Thomas Gleixner]

On Tue, 26 Feb 2019, Len Brown wrote:

> This patch series does 4 things.
> 
> 1. Parses the new CPUID.1F leaf to discover multi-die/package topology
> 
> 2. Export multi-die topology inside the kernel
> 
> 3. Update 3 places (coretemp, pkgtemp, rapl) that that need to know
>    the difference between die and package-scope MSR.
> 
>    (Note: Kan Liang has a patch series on top of this one to similarly
>    make the uncore perf code multi-die/package aware.)
> 
> 4. Export multi-die topology to user-space via sysfs

Aside of the few nitpicks (which apply to several patches) this looks very
nice.

Thanks,

	tglx