Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

From: Wangtao (Kevin, Kirin)
Date: Tue Jun 20 2017 - 22:12:36 EST




e( 2017/6/20 18:27, Wei Xu ei:
Hi Tao,

On 2017/6/20 4:40, Tao Wang wrote:
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.

Signed-off-by: Tao Wang <kevin.wangtao@xxxxxxxxxxxxx>
---
.../devicetree/bindings/thermal/hi3660-thermal.txt | 17 +++++++++++++++++
1 file changed, 17 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt

diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
new file mode 100644
index 0000000..c034670
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
@@ -0,0 +1,17 @@
+* Temperature Sensor on hisilicon hi3660 SoC
+
+** Required properties :
+
+- compatible: "hisilicon,thermal-hi3660".

It is better to put the SoC name before the function string.
ok, I will fix it, thank you.

BR,
Wei

+- reg: physical base address of thermal sensor and length of memory mapped
+ region.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+ tsensor: tsensor {
+ compatible = "hisilicon,thermal-hi3660";
+ reg = <0x0 0xfff30000 0x0 0x1000>;
+ #thermal-sensor-cells = <1>;
+ status = "ok";
+ };



.