Re: [PATCH] thermal: Bind cooling devices with the correct arguments

[Punit Agrawal]

Stephen Boyd <sboyd@xxxxxxxxxxxxxx> writes:

> On 06/17/14 03:20, Punit Agrawal wrote:
>> Ping?
>>
>> Punit Agrawal <punit.agrawal@xxxxxxx> writes:
>>
>>> When binding cooling devices to thermal zones created from the device
>>> tree the minimum and maximum cooling states are in the wrong order
>>> leading to failure to bind.
>>>
>>> Fix the order of cooling states in the call to
>>> thermal_zone_bind_cooling_device to fix this.
>>>
>>> Cc:Zhang Rui <rui.zhang@xxxxxxxxx>
>>> Signed-off-by: Punit Agrawal <punit.agrawal@xxxxxxx>
>
> Ah I ran into the same problem while testing out some thermal DT stuff.
>
> Reviewed-by: Stephen Boyd <sboyd@xxxxxxxxxxxxxx>

Thanks Stephen!

Rui, can you pick this patch?
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